BAV19W vs BAV10136 feature comparison

BAV19W Sangdest Microelectronics (Nanjing) Co Ltd

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BAV10136 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-2 O-LALF-W2
Reach Compliance Code compliant unknown
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code R-PDSO-G2 O-LALF-W2
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Output Current-Max 0.2 A 0.3 A
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation-Max 0.41 W 0.35 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 100 V 60 V
Reverse Recovery Time-Max 0.05 µs 0.006 µs
Surface Mount YES NO
Terminal Form GULL WING WIRE
Terminal Position DUAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 7 1
ECCN Code EAR99
HTS Code 8541.10.00.70
Application GENERAL PURPOSE
Case Connection ISOLATED
Forward Voltage-Max (VF) 1.25 V
JEDEC-95 Code DO-35
Non-rep Pk Forward Current-Max 9 A
Operating Temperature-Max 200 °C
Reverse Current-Max 0.1 µA

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