BAV99BRW
vs
BAV99S
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
GALAXY SEMI-CONDUCTOR CO LTD
|
NXP SEMICONDUCTORS
|
| Package Description |
R-PDSO-G6
|
PLASTIC, SC-88, 6 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Application |
FAST RECOVERY
|
|
| Breakdown Voltage-Min |
75 V
|
|
| Configuration |
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
0.715 V
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| Non-rep Pk Forward Current-Max |
2 A
|
4 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
0.15 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Dissipation-Max |
0.2 W
|
0.25 W
|
| Rep Pk Reverse Voltage-Max |
75 V
|
100 V
|
| Reverse Current-Max |
2.5 µA
|
0.5 µA
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Reverse Test Voltage |
75 V
|
80 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
10
|
11
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SC-88
|
| Pin Count |
|
6
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin (Sn)
|
|
|
|
Compare BAV99BRW with alternatives
Compare BAV99S with alternatives