BC847,215 vs BC847AM,315 feature comparison

BC847,215 NXP Semiconductors

Buy Now Datasheet

BC847AM,315 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TO-236 DFN
Package Description PLASTIC PACKAGE-3 1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, LEADLESS, PLASTIC, SC-101, 3 PIN
Pin Count 3 3
Manufacturer Package Code SOT23 SOT883
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 45 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 110 110
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PBCC-N3
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.25 W 0.25 W
Qualification Status Not Qualified Not Qualified
Reference Standard IEC-60134 IEC-60134
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING NO LEAD
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.6 V
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Case Connection COLLECTOR

Compare BC847,215 with alternatives

Compare BC847AM,315 with alternatives