BCM53101MIMLGG
vs
KSZ8567STXV-VAO
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
BROADCOM LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PACKAGE
|
TQFP-128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2016-09-16
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Terminal Position |
UNSPECIFIED
|
QUAD
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| JESD-30 Code |
|
S-PQFP-G128
|
| Length |
|
14 mm
|
| Number of Terminals |
|
128
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Code |
|
HTFQFP
|
| Package Equivalence Code |
|
TQFP128,.63SQ,16
|
| Package Style |
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.2 mm
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.4 mm
|
| Width |
|
14 mm
|
|
|
|
Compare BCM53101MIMLGG with alternatives
Compare KSZ8567STXV-VAO with alternatives