BCM53106PKFBG
vs
VSC8514XMK-14
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
BROADCOM INC
|
MICROSEMI CORP
|
| Package Description |
TFBGA,
|
QFN-138
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-30 Code |
S-PBGA-B212
|
S-PBCC-B138
|
| Length |
11 mm
|
12 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
212
|
138
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
HVBCC
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.017 mm
|
0.85 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
BUTT
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
12 mm
|
| Base Number Matches |
1
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Date Of Intro |
|
2018-08-21
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare BCM53106PKFBG with alternatives
Compare VSC8514XMK-14 with alternatives