BCP56-TAPE-13 vs BCP56-16-TP feature comparison

BCP56-TAPE-13 NXP Semiconductors

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BCP56-16-TP Micro Commercial Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS CORP
Package Description SMALL OUTLINE, R-PDSO-G4 ,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Rohs Code Yes
Collector Current-Max (IC) 1 A
Collector-Emitter Voltage-Max 80 V
DC Current Gain-Min (hFE) 100
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN
Power Dissipation-Max (Abs) 1.5 W
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 10
Transition Frequency-Nom (fT) 100 MHz
VCEsat-Max 0.5 V

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Compare BCP56-16-TP with alternatives