BD138 vs BD138 feature comparison

BD138 NXP Semiconductors

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BD138 Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SIP TO-225AA
Package Description PLASTIC, TO-126, 3 PIN PLASTIC, CASE 77-09, 3 PIN
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.29.00.75
Case Connection COLLECTOR
Collector Current-Max (IC) 1.5 A 1.5 A
Collector-Emitter Voltage-Max 60 V 60 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 25 25
JEDEC-95 Code TO-126 TO-225AA
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type PNP PNP
Power Dissipation Ambient-Max 8 W
Power Dissipation-Max (Abs) 8 W
Qualification Status Not Qualified COMMERCIAL
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 160 MHz
VCEsat-Max 0.5 V
Base Number Matches 4 3
Pbfree Code No
Manufacturer Package Code CASE 77-09
JESD-609 Code e0
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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