BD241 vs JANHC2N6213 feature comparison

BD241 STMicroelectronics

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JANHC2N6213 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MICROSEMI CORP
Part Package Code SFM DIE
Package Description FLANGE MOUNT, R-PSFM-T3 UNCASED CHIP, S-XUUC-N2
Pin Count 3 2
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Collector Current-Max (IC) 3 A 2 A
Collector-Emitter Voltage-Max 45 V 350 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 10 10
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3 S-XUUC-N2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 3 2
Operating Temperature-Max 150 °C 200 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR SQUARE
Package Style FLANGE MOUNT UNCASED CHIP
Polarity/Channel Type NPN PNP
Power Dissipation Ambient-Max 40 W
Power Dissipation-Max (Abs) 40 W 20 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position SINGLE UPPER
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 3 MHz 20 MHz
VCEsat-Max 1.2 V
Base Number Matches 8 1
Case Connection COLLECTOR
Reference Standard MIL-19500/461E

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