BDX33B vs BD237 feature comparison

BDX33B Samsung Semiconductor

Buy Now Datasheet

BD237 Motorola Mobility LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MOTOROLA INC
Part Package Code SFM TO-225AA
Package Description TO-220, 3 PIN FLANGE MOUNT, R-PSFM-T3
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 10 A 2 A
Collector-Emitter Voltage-Max 80 V 80 V
Configuration DARLINGTON SINGLE
DC Current Gain-Min (hFE) 750 25
JEDEC-95 Code TO-220AB TO-225AA
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 70 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 3 MHz 3 MHz
Base Number Matches 1 1
Manufacturer Package Code CASE 77-08
HTS Code 8541.29.00.95
Power Dissipation Ambient-Max 25 W
VCEsat-Max 0.6 V

Compare BDX33B with alternatives

Compare BD237 with alternatives