BF256C
vs
BF556C,215
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
CYLINDRICAL, O-PBCY-T3
|
PLASTIC PACKAGE-3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| DS Breakdown Voltage-Min |
30 V
|
30 V
|
| Drain Current-Max (ID) |
0.1 A
|
|
| FET Technology |
JUNCTION
|
JUNCTION
|
| Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
VERY HIGH FREQUENCY BAND
|
| JEDEC-95 Code |
TO-92
|
TO-236AB
|
| JESD-30 Code |
O-PBCY-T3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
0.3 W
|
0.25 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
12
|
1
|
| Part Package Code |
|
TO-236
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
SOT23
|
| HTS Code |
|
8541.21.00.75
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare BF256C with alternatives
Compare BF556C,215 with alternatives