BF824,215
vs
BF824W,135
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-236
|
SC-70
|
| Package Description |
PLASTIC, SST, 3 PIN
|
PLASTIC, UMT3, SMD, SC-70, CMPAK-3
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
SOT23
|
SOT323
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
1997-09-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Collector Current-Max (IC) |
0.025 A
|
0.025 A
|
| Collector-Base Capacitance-Max |
0.3 pF
|
|
| Collector-Emitter Voltage-Max |
30 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
25
|
25
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
PNP
|
PNP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
AEC-Q101
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
450 MHz
|
250 MHz
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8541.21.00.75
|
| Power Dissipation-Max (Abs) |
|
0.2 W
|
|
|
|
Compare BF824,215 with alternatives
Compare BF824W,135 with alternatives