BF861A-T vs BF861A,215 feature comparison

BF861A-T NXP Semiconductors

Buy Now Datasheet

BF861A,215 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT-23 TO-236
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC PACKAGE-3
Pin Count 3 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Additional Feature LOW NOISE LOW NOISE
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 25 V 25 V
FET Technology JUNCTION JUNCTION
Feedback Cap-Max (Crss) 2.7 pF 2.7 pF
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode DEPLETION MODE DEPLETION MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 6 1
Rohs Code Yes
Manufacturer Package Code SOT23
HTS Code 8541.21.00.95
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.25 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare BF861A-T with alternatives

Compare BF861A,215 with alternatives