BLF278
vs
MRF176GV
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
SOT
|
|
| Package Description |
SOT-262A1, 4 PIN
|
FLANGE MOUNT, R-CDFM-F4
|
| Pin Count |
4
|
|
| Manufacturer Package Code |
SOT262A1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.75
|
8541.29.00.75
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
SOURCE
|
SOURCE
|
| Configuration |
COMMON SOURCE, 2 ELEMENTS
|
COMMON SOURCE, 2 ELEMENTS
|
| DS Breakdown Voltage-Min |
125 V
|
125 V
|
| Drain Current-Max (ID) |
18 A
|
16 A
|
| Drain-source On Resistance-Max |
0.3 Ω
|
1 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Highest Frequency Band |
VERY HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
| JESD-30 Code |
R-CDFM-F4
|
R-CDFM-F4
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
4
|
4
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation Ambient-Max |
500 W
|
400 W
|
| Power Dissipation-Max (Abs) |
500 W
|
400 W
|
| Power Gain-Min (Gp) |
20 dB
|
15 dB
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare BLF278 with alternatives
Compare MRF176GV with alternatives