BLF7G20LS-200 vs BLF8G20LS-200V feature comparison

BLF7G20LS-200 Ampleon

Buy Now Datasheet

BLF8G20LS-200V NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer AMPLEON NETHERLANDS B V NXP SEMICONDUCTORS
Package Description FLATPACK, R-CDFP-F2 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Additional Feature ESD PROTECTED
Case Connection SOURCE
Configuration SINGLE
DS Breakdown Voltage-Min 65 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band L BAND
JESD-30 Code R-CDFP-F2
Moisture Sensitivity Level NOT APPLICABLE
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Qualification Status Not Qualified
Surface Mount YES
Terminal Form FLAT
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Transistor Application AMPLIFIER
Transistor Element Material SILICON
Base Number Matches 2 2
Rohs Code Yes

Compare BLF7G20LS-200 with alternatives