BLV193 vs PH0810-15 feature comparison

BLV193 NXP Semiconductors

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PH0810-15 TE Connectivity

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS TE CONNECTIVITY LTD
Part Package Code SOT
Package Description FLANGE MOUNT, R-CDFM-F6
Pin Count 6
Manufacturer Package Code SOT171A
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Additional Feature HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS WITH EMITTER BALLASTING RESISTORS
Case Connection ISOLATED
Collector Current-Max (IC) 3.5 A 1.8 A
Collector-Emitter Voltage-Max 16 V 24 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 25
Highest Frequency Band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-CDFM-F6 R-CDFM-F6
Number of Elements 1 1
Number of Terminals 6 6
Operating Temperature-Max 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 44 W
Power Dissipation-Max (Abs) 44 W
Power Gain-Min (Gp) 6.5 dB
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare PH0810-15 with alternatives