BQ24295RGET
vs
MP2661GC-0000
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MONOLITHIC POWER SYSTEMS INC
|
| Package Description |
VQFN-24
|
VFBGA, BGA9,3X3,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| Input Voltage-Max |
6.2 V
|
|
| Input Voltage-Min |
3.9 V
|
|
| JESD-30 Code |
S-PQCC-N24
|
S-XBCS-B9
|
| JESD-609 Code |
e4
|
|
| Length |
4 mm
|
1.55 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
9
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
CSP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP SCALE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
0.68 mm
|
| Supply Current-Max (Isup) |
3 mA
|
0.024 mA
|
| Supply Voltage-Max (Vsup) |
6.2 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3.9 V
|
4.35 V
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Threshold Voltage-Nom |
+6.4V
|
+6V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 mm
|
1.55 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2018-04-09
|
| Package Equivalence Code |
|
BGA9,3X3,20
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare BQ24295RGET with alternatives
Compare MP2661GC-0000 with alternatives