BQ27505YZGT-J1
vs
BQ27505YZGR-J3
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
DSBGA-12
|
DSBGA-12
|
Pin Count |
12
|
12
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PBGA-B12
|
R-XBGA-B12
|
JESD-609 Code |
e1
|
e1
|
Length |
2.295 mm
|
2.295 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA12,3X4,20
|
BGA12,3X4,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
0.625 mm
|
Supply Voltage-Max (Vsup) |
2.6 V
|
2.6 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.795 mm
|
1.795 mm
|
Base Number Matches |
1
|
1
|
|
|
|
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