BQ27520YZFT-G3
vs
BQ27520YZFR-G1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA, BGA15,3X5,20
|
DSBGA-15
|
| Pin Count |
15
|
15
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PBGA-B15
|
R-XBGA-B15
|
| JESD-609 Code |
e1
|
e1
|
| Length |
2.61 mm
|
2.61 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
15
|
15
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA15,3X5,20
|
BGA15,3X5,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.625 mm
|
0.625 mm
|
| Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.956 mm
|
1.956 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BQ27520YZFT-G3 with alternatives
Compare BQ27520YZFR-G1 with alternatives