BQ27520YZFT-G4
vs
BQ27520YZFT-G1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA, BGA15,3X5,20
|
DSBGA-15
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
ALSO OPERATES WITH SUPPLY VOLTAGE 2.45 TO 2.8V
|
|
Adjustable Threshold |
NO
|
YES
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
JESD-30 Code |
R-XBGA-B15
|
R-XBGA-B15
|
JESD-609 Code |
e1
|
e1
|
Length |
2.61 mm
|
2.61 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
15
|
15
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA15,3X5,20
|
BGA15,3X5,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
0.625 mm
|
Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Min (Vsup) |
2.8 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.956 mm
|
1.956 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
15
|
|
|
|
Compare BQ27520YZFT-G4 with alternatives
Compare BQ27520YZFT-G1 with alternatives