BQ298015RUGT
vs
BQ298009RUGR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
X2QFN-8
|
X2QFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2020-12-05
|
2020-11-13
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| JESD-30 Code |
S-PQCC-N8
|
S-PQCC-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
1.5 mm
|
1.5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
LCC8,.06SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.4 mm
|
0.4 mm
|
| Supply Current-Max (Isup) |
0.008 mA
|
0.008 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.5 V
|
1.5 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Threshold Voltage-Nom |
+2.8V
|
+2.9V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.5 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BQ298015RUGT with alternatives
Compare BQ298009RUGR with alternatives