BSP50T/R
vs
BSP52,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
PLASTIC, SMD, SC-73, 4 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
2 A
|
0.5 A
|
| Configuration |
DARLINGTON
|
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
| DC Current Gain-Min (hFE) |
2000
|
2000
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
1.5 W
|
1.5 W
|
| Surface Mount |
YES
|
YES
|
| Transition Frequency-Nom (fT) |
200 MHz
|
200 MHz
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
SC-73
|
| Pin Count |
|
4
|
| Manufacturer Package Code |
|
SOT223
|
| HTS Code |
|
8541.29.00.75
|
| Case Connection |
|
COLLECTOR
|
| Collector-Emitter Voltage-Max |
|
80 V
|
| JESD-30 Code |
|
R-PDSO-G4
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
4
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Power Dissipation Ambient-Max |
|
1.5 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
| VCEsat-Max |
|
1.3 V
|
|
|
|
Compare BSP52,115 with alternatives