BSP51T/R
vs
BSP51
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active Unconfirmed
|
Obsolete
|
| Package Description |
,
|
Lead Free Package-4
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2017-02-01
|
|
| Base Number Matches |
3
|
9
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOT-223
|
| Pin Count |
|
4
|
| Manufacturer Package Code |
|
MOLDED PACKAGE, SOT-223, 4 LEAD
|
| HTS Code |
|
8541.21.00.95
|
| Case Connection |
|
Collector
|
| Collector Current-Max (IC) |
|
0.5 A
|
| Collector-Emitter Voltage-Max |
|
80 V
|
| Configuration |
|
Single
|
| DC Current Gain-Min (hFE) |
|
2000
|
| JESD-30 Code |
|
R-PDSO-G4
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
4
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
Plastic/Epoxy
|
| Package Shape |
|
Rectangular
|
| Package Style |
|
Small Outline
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Polarity/Channel Type |
|
Npn
|
| Power Dissipation-Max (Abs) |
|
1.5 W
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
Yes
|
| Terminal Finish |
|
Matte Tin
|
| Terminal Form |
|
Gull Wing
|
| Terminal Position |
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transistor Element Material |
|
Silicon
|
|
|
|