BSR56-T vs BSR56,215 feature comparison

BSR56-T NXP Semiconductors

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BSR56,215 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, SMD, SST3, 3 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 40 V 40 V
Drain Current-Max (ID) 0.02 A 0.02 A
Drain-source On Resistance-Max 25 Ω 25 Ω
FET Technology JUNCTION JUNCTION
Feedback Cap-Max (Crss) 5 pF 5 pF
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode DEPLETION MODE DEPLETION MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 6 1
Rohs Code Yes
Part Package Code TO-236
Pin Count 3
Manufacturer Package Code SOT23
HTS Code 8541.21.00.95
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.3 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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Compare BSR56,215 with alternatives