BSS192,135
vs
2N7008-G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOT-89
|
|
| Package Description |
PLASTIC, SC-62, 3 PIN
|
GREEN PACKAGE-3
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT89
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.21.00.75
|
8542.39.00.01
|
| Additional Feature |
CMOS COMPATIBLE
|
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
240 V
|
60 V
|
| Drain Current-Max (ID) |
0.2 A
|
0.23 A
|
| Drain-source On Resistance-Max |
12 Ω
|
7.5 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
15 pF
|
5 pF
|
| JEDEC-95 Code |
TO-243AA
|
TO-92
|
| JESD-30 Code |
R-PSSO-F3
|
O-PBCY-T3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
P-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
44 Weeks, 5 Days
|
| Samacsys Manufacturer |
|
Microchip
|
| Operating Temperature-Min |
|
-55 °C
|
|
|
|
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