BSS192,135 vs TN2524ND feature comparison

BSS192,135 NXP Semiconductors

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TN2524ND Supertex Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS SUPERTEX INC
Part Package Code SOT-89 DIE
Package Description PLASTIC, SC-62, 3 PIN UNCASED CHIP, X-XUUC-N
Pin Count 3
Manufacturer Package Code SOT89
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.75
Additional Feature CMOS COMPATIBLE LOGIC LEVEL COMPATIBLE, HIGH INPUT IMPEDANCE, LOW THRESHOLD
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 240 V 240 V
Drain Current-Max (ID) 0.2 A
Drain-source On Resistance-Max 12 Ω 6 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 15 pF 25 pF
JEDEC-95 Code TO-243AA
JESD-30 Code R-PSSO-F3 X-XUUC-N
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type P-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 1 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN TIN LEAD
Terminal Form FLAT NO LEAD
Terminal Position SINGLE UPPER
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Pbfree Code No

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