BST82
vs
TP4859
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
ALLEGRO MICROSYSTEMS LLC
|
Package Description |
SOT-23, 3 PIN
|
CYLINDRICAL, O-PBCY-T3
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Date Of Intro |
1987-06-08
|
|
Additional Feature |
LOGIC LEVEL COMPATIBLE
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
DS Breakdown Voltage-Min |
100 V
|
|
Drain Current-Max (ID) |
0.19 A
|
|
Drain-source On Resistance-Max |
10 Ω
|
25 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
JUNCTION
|
Feedback Cap-Max (Crss) |
10 pF
|
8 pF
|
JESD-30 Code |
R-PDSO-G3
|
O-PBCY-T3
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
DEPLETION MODE
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Reference Standard |
IEC-60134
|
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
5
|
19
|
JEDEC-95 Code |
|
TO-226AA
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare BST82 with alternatives
Compare TP4859 with alternatives