BTS500801TEBAUMA1
vs
BTS500801EGAAUMA1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
,
|
PACKAGE-12
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8541.29.00.95
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Infineon
|
Infineon
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PSSO-G4
|
R-PDSO-G12
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6.5 mm
|
7.5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
12
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-252
|
HSSOP
|
| Package Equivalence Code |
SMSIP4/5H,.39,44TB
|
SSOP12,.4,39
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
2.5 mm
|
2.6 mm
|
| Supply Current-Max (Isup) |
2.2 mA
|
24 mA
|
| Supply Voltage-Max (Vsup) |
30 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
5.5 V
|
9 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
13.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SIPMOS
|
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.14 mm
|
1 mm
|
| Terminal Position |
SINGLE
|
DUAL
|
| Threshold Voltage-Nom |
+3.5V
|
+2.8V
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.22 mm
|
6.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BTS500801TEBAUMA1 with alternatives
Compare BTS500801EGAAUMA1 with alternatives