BU2525AX vs BU2527AF feature comparison

BU2525AX Inchange Semiconductor Company Ltd

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BU2527AF NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer INCHANGE SEMICONDUCTOR CO LTD NXP SEMICONDUCTORS
Package Description , PLASTIC, SOT-199, 3 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Base Number Matches 3 4
Rohs Code Yes
Part Package Code SFM
Pin Count 3
Manufacturer Package Code SOT199
HTS Code 8541.29.00.95
Additional Feature FORMED LEAD OPTIONS ARE AVAILABLE
Case Connection ISOLATED
Collector Current-Max (IC) 12 A
Collector-Emitter Voltage-Max 800 V
Configuration SINGLE
DC Current Gain-Min (hFE) 5
JESD-30 Code R-PSFM-T3
JESD-609 Code e3
Number of Elements 1
Number of Terminals 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type NPN
Power Dissipation Ambient-Max 45 W
Power Dissipation-Max (Abs) 45 W
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 2200 ns
VCEsat-Max 5 V

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