BU4052BCF
vs
BU4052BC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP, SOP16,.25
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e2
|
e2
|
Length |
10 mm
|
19.4 mm
|
Number of Channels |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
50 dB
|
50 dB
|
On-state Resistance Match-Nom |
10 Ω
|
10 Ω
|
On-state Resistance-Max (Ron) |
950 Ω
|
950 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.71 mm
|
4.55 mm
|
Supply Current-Max (Isup) |
0.015 mA
|
0.015 mA
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Switch-off Time-Max |
550 ns
|
550 ns
|
Switch-on Time-Max |
550 ns
|
550 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Copper (Sn/Cu)
|
Tin/Copper (Sn/Cu)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
4.4 mm
|
7.62 mm
|
Base Number Matches |
8
|
10
|
Samacsys Manufacturer |
|
ROHM Semiconductor
|
|
|
|