BU4522AF
vs
2N5733.MOD
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TT ELECTRONICS PLC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
ISOLATED
|
|
| Collector Current-Max (IC) |
10 A
|
30 A
|
| Collector-Emitter Voltage-Max |
800 V
|
80 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
4.2
|
30
|
| JESD-30 Code |
R-PSFM-T3
|
O-MUPM-D3
|
| JESD-609 Code |
e3
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
POST/STUD MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
45 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
SOLDER LUG
|
| Terminal Position |
SINGLE
|
UPPER
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
POST/STUD MOUNT, O-MUPM-D3
|
| JEDEC-95 Code |
|
TO-63
|
| Transition Frequency-Nom (fT) |
|
30 MHz
|
|
|
|
Compare BU4522AF with alternatives
Compare 2N5733.MOD with alternatives