BU8241FS-T1 vs TA31137FNG feature comparison

BU8241FS-T1 ROHM Semiconductor

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TA31137FNG Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROHM CO LTD TOSHIBA CORP
Part Package Code SSOP SSOP
Package Description SSOP-24 LSSOP,
Pin Count 24 24
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e3/e2
Length 10 mm 7.8 mm
Number of Functions 1 1
Number of Terminals 24 24
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.01 mm 1.6 mm
Surface Mount YES YES
Telecom IC Type SUPPORT CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Terminal Finish TIN/TIN COPPER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10 NOT SPECIFIED
Width 5.4 mm 5.6 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Supply Current-Max 5.6 mA
Supply Voltage-Nom 3 V
Technology BIPOLAR
Temperature Grade OTHER

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