BUK416-100AE
vs
APT10M07JVFR
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROSEMI CORP
|
Package Description |
FLANGE MOUNT, R-PUFM-D4
|
ISOTOP-4
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
100 V
|
100 V
|
Drain Current-Max (ID) |
110 A
|
225 A
|
Drain-source On Resistance-Max |
0.013 Ω
|
0.007 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PUFM-D4
|
R-PUFM-X4
|
Number of Elements |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
UNSPECIFIED
|
Terminal Position |
UPPER
|
UPPER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
ISOTOP
|
Pin Count |
|
4
|
Manufacturer Package Code |
|
ISOTOP
|
Avalanche Energy Rating (Eas) |
|
3600 mJ
|
Case Connection |
|
ISOLATED
|
JESD-609 Code |
|
e1
|
Operating Temperature-Max |
|
150 °C
|
Power Dissipation-Max (Abs) |
|
700 W
|
Pulsed Drain Current-Max (IDM) |
|
900 A
|
Reference Standard |
|
UL RECOGNIZED
|
Terminal Finish |
|
TIN SILVER COPPER
|
Transistor Application |
|
SWITCHING
|
|
|
|
Compare BUK416-100AE with alternatives
Compare APT10M07JVFR with alternatives