BUS50
vs
BUR50
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
CRIMSON SEMICONDUCTOR INC
|
| Package Description |
FLANGE MOUNT, O-MBFM-P2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
70 A
|
70 A
|
| Collector-Emitter Voltage-Max |
125 V
|
125 V
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
15
|
|
| JEDEC-95 Code |
TO-204AE
|
TO-3
|
| JESD-30 Code |
O-MBFM-P2
|
O-MBFM-P2
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
350 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8541.29.00.95
|
| Additional Feature |
|
VERY LOW LEAKAGE
|
| Power Dissipation Ambient-Max |
|
350 W
|
| VCEsat-Max |
|
1.5 V
|
|
|
|
Compare BUS50 with alternatives
Compare BUR50 with alternatives