BUV19R1 vs BUV19 feature comparison

BUV19R1 TT Electronics Power and Hybrid / Semelab Limited

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BUV19 STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SEMELAB LTD STMICROELECTRONICS
Part Package Code BFM
Package Description FLANGE MOUNT, O-MBFM-P2
Pin Count 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 50 A 50 A
Collector-Emitter Voltage-Max 80 V 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 20 20
JEDEC-95 Code TO-204AE TO-3
JESD-30 Code O-MBFM-P2 O-MBFM-P2
JESD-609 Code e1 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 8 MHz 8 MHz
Base Number Matches 1 1
HTS Code 8541.29.00.95
Power Dissipation Ambient-Max 250 W
Power Dissipation-Max (Abs) 250 W
Turn-off Time-Max (toff) 1350 ns
Turn-on Time-Max (ton) 1300 ns
VCEsat-Max 1.2 V

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