BUV21 vs BUV21.MODR1 feature comparison

BUV21 STMicroelectronics

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BUV21.MODR1 TT Electronics Power and Hybrid / Semelab Limited

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS SEMELAB LTD
Package Description FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, O-MBFM-P2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 40 A 40 A
Collector-Emitter Voltage-Max 200 V 200 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 10 20
JEDEC-95 Code TO-3 TO-204AE
JESD-30 Code O-MBFM-P2 O-MBFM-P2
JESD-609 Code e0 e1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 250 W
Power Dissipation-Max (Abs) 250 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 8 MHz 8 MHz
Turn-off Time-Max (toff) 2200 ns
Turn-on Time-Max (ton) 1200 ns
VCEsat-Max 1.5 V
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BFM
Pin Count 2

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