BUV298AV vs BUV298AV feature comparison

BUV298AV STMicroelectronics

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BUV298AV NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Package Description ISOTOP-3 FLANGE MOUNT, R-PUFM-D3
Pin Count 3
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection ISOLATED
Collector Current-Max (IC) 60 A 96 A
Collector-Emitter Voltage-Max 450 V 450 V
Configuration SINGLE SINGLE
Fall Time-Max (tf) 400 ns
JESD-30 Code R-XUFM-X3 R-PUFM-D3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 250 W
Power Dissipation-Max (Abs) 250 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish NICKEL
Terminal Form UNSPECIFIED SOLDER LUG
Terminal Position UPPER UPPER
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
VCEsat-Max 1.2 V 1.2 V
Base Number Matches 1 1