BYV29-500,127
vs
BYR29-500
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
|
Part Package Code |
TO-220
|
|
Package Description |
PLASTIC PACKAGE-2
|
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD59
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
|
Factory Lead Time |
4 Weeks
|
|
Application |
ULTRA FAST SOFT RECOVERY
|
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.4 V
|
1.6 V
|
JEDEC-95 Code |
TO-220AC
|
|
JESD-30 Code |
R-PSFM-T2
|
|
JESD-609 Code |
e3
|
e0
|
Non-rep Pk Forward Current-Max |
110 A
|
72 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Output Current-Max |
9 A
|
8 A
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLANGE MOUNT
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
500 V
|
500 V
|
Reverse Recovery Time-Max |
0.06 µs
|
0.075 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
SINGLE
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
5
|
|
|
|
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