BYV29-600
vs
HFA08TB60
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERNATIONAL RECTIFIER CORP
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
SOFT RECOVERY
|
ULTRA FAST SOFT RECOVERY
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.45 V
|
1.7 V
|
JEDEC-95 Code |
TO-220AC
|
TO-220AC
|
JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
JESD-609 Code |
e3
|
e0
|
Non-rep Pk Forward Current-Max |
77 A
|
60 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Output Current-Max |
9 A
|
8 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
Reverse Recovery Time-Max |
0.06 µs
|
0.055 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
8
|
Additional Feature |
|
LOW NOISE
|
Reverse Current-Max |
|
5 µA
|
|
|
|
Compare BYV29-600 with alternatives
Compare HFA08TB60 with alternatives