BZM55C9V1
vs
MM3Z9V1ST1G
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
ONSEMI
|
| Part Package Code |
MELF
|
SOD-323 2 LEAD
|
| Package Description |
O-LELF-R2
|
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 477-02, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
10 Ω
|
15 Ω
|
| JESD-30 Code |
O-LELF-R2
|
R-PDSO-G2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
50 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.3 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
9.6 V
|
9.1 V
|
| Reverse Current-Max |
0.0001 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
WRAP AROUND
|
GULL WING
|
| Terminal Position |
END
|
DUAL
|
| Voltage Tol-Max |
6.08%
|
2.1%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
10
|
1
|
| Manufacturer Package Code |
|
477-02
|
| Factory Lead Time |
|
12 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BZM55C9V1 with alternatives
Compare MM3Z9V1ST1G with alternatives