BZT52C3V9 vs MX1N5227DUR-1E3 feature comparison

BZT52C3V9 Lite-On Semiconductor Corporation

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MX1N5227DUR-1E3 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LITE-ON SEMICONDUCTOR CORP MICROSEMI CORP
Package Description GREEN, ULTRA SMALL, PLASTIC PACKAGE-2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, MLL34, MELF-2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-PDSO-G2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.9 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form GULL WING WRAP AROUND
Terminal Position DUAL END
Voltage Tol-Max 5.13% 1%
Working Test Current 5 mA 20 mA
Base Number Matches 2 2
Rohs Code Yes
Part Package Code DO-213AA
Case Connection ISOLATED
JEDEC-95 Code DO-213AA
JESD-609 Code e3
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500
Terminal Finish MATTE TIN

Compare BZT52C3V9 with alternatives

Compare MX1N5227DUR-1E3 with alternatives