BZT52H-B3V6 vs BZT52H-B3V6,115 feature comparison

BZT52H-B3V6 NXP Semiconductors

Buy Now Datasheet

BZT52H-B3V6,115 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-2 PLASTIC PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code R-PDSO-F2 R-PDSO-F2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.375 W 0.375 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN TIN
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Voltage Tol-Max 1.94% 1.94%
Working Test Current 5 mA 5 mA
Base Number Matches 3 1
Part Package Code SOD-123
Manufacturer Package Code SOD123F
Factory Lead Time 4 Weeks
Dynamic Impedance-Max 500 Ω
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare BZT52H-B3V6 with alternatives

Compare BZT52H-B3V6,115 with alternatives