BZT52H-C13 vs MV1N5243AE3 feature comparison

BZT52H-C13 NXP Semiconductors

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MV1N5243AE3 Microsemi Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Package Description PLASTIC PACKAGE-2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 110 Ω
JESD-30 Code R-PDSO-F2 O-LALF-W2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 175 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.375 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 13.25 V 13 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form FLAT WIRE
Terminal Position DUAL AXIAL
Time@Peak Reflow Temperature-Max (s) 30
Voltage Tol-Max 6.42% 10%
Working Test Current 5 mA 9.5 mA
Base Number Matches 2 1
Part Package Code DO-7
Case Connection ISOLATED
JEDEC-95 Code DO-204AA
Operating Temperature-Min -65 °C

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