BZT52H-C3V6,115 vs BZV55C3V9 feature comparison

BZT52H-C3V6,115 NXP Semiconductors

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BZV55C3V9 Central Semiconductor Corp

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS CENTRAL SEMICONDUCTOR CORP
Part Package Code SOD-123
Package Description PLASTIC PACKAGE-2 SOD-80, 2 PIN
Pin Count 2
Manufacturer Package Code SOD123F
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 500 Ω 90 Ω
JESD-30 Code R-PDSO-F2 O-LELF-R2
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 200 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.375 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.9 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form FLAT WRAP AROUND
Terminal Position DUAL END
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Voltage Tol-Max 5.56% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 2 28
Pbfree Code No
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED
Forward Voltage-Max (VF) 1.1 V
Knee Impedance-Max 600 Ω
Operating Temperature-Min -65 °C
Reverse Current-Max 3 µA
Reverse Test Voltage 1 V

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Compare BZV55C3V9 with alternatives