BZT52H-C3V6
vs
JANHCA1N5519C
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
DEFENSE LOGISTICS AGENCY
|
| Package Description |
PLASTIC PACKAGE-2
|
DIE-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Samacsys Manufacturer |
NXP
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
500 Ω
|
|
| JESD-30 Code |
R-PDSO-F2
|
S-XXUC-N2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.375 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Position |
DUAL
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5.56%
|
2%
|
| Working Test Current |
5 mA
|
20 mA
|
| Base Number Matches |
4
|
1
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
CATHODE
|
| Reference Standard |
|
MIL-19500/437E
|
|
|
|
Compare BZT52H-C3V6 with alternatives
Compare JANHCA1N5519C with alternatives