BZV55-B33,135 vs BZV55-B33 feature comparison

BZV55-B33,135 NXP Semiconductors

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BZV55-B33 General Instrument Corp

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL INSTRUMENT CORP
Package Description O-LELF-R2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 2 mA 5 mA
Base Number Matches 2 1

Compare BZV55-B33,135 with alternatives

Compare BZV55-B33 with alternatives