BZV55-B3V9
vs
BZV55-B3V9,135
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
GENERAL INSTRUMENT CORP
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
unknown
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.4 W
|
0.4 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
3.9 V
|
3.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Package Description |
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Operating Temperature-Max |
|
200 °C
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
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