BZV55-C39135
vs
BZV55C39-T1
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Package Description |
O-LELF-R2
|
O-LELF-R2
|
| Reach Compliance Code |
unknown
|
unknown
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.4 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
39 V
|
39 V
|
| Reverse Current-Max |
0.05 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Voltage Temp Coeff-Max |
41.2 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5.13%
|
| Working Test Current |
2 mA
|
2.5 mA
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
|
|
|
Compare BZV55-C39135 with alternatives
Compare BZV55C39-T1 with alternatives