BZV55C12
vs
MMBZ5239B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MULTICOMP PRO
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
PLASTIC PACKAGE-3
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
R-PDSO-G3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Temperature-Max |
200 °C
|
150 °C
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.4 W
|
0.41 W
|
| Reference Voltage-Nom |
12 V
|
9.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WRAP AROUND
|
GULL WING
|
| Terminal Position |
END
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
5 mA
|
20 mA
|
| Base Number Matches |
1
|
4
|
| Operating Temperature-Min |
|
-55 °C
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare BZV55C12 with alternatives
Compare MMBZ5239B with alternatives