BZV55C12 vs BZT55C12L1G feature comparison

BZV55C12 SPC Multicomp

Buy Now Datasheet

BZT55C12L1G Taiwan Semiconductor

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active End Of Life
Ihs Manufacturer MULTICOMP PRO TAIWAN SEMICONDUCTOR CO LTD
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Reference Voltage-Nom 12 V 12 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 28 1
Dynamic Impedance-Max 20 Ω
JEDEC-95 Code DO-213AA
JESD-609 Code e3
Knee Impedance-Max 90 Ω
Moisture Sensitivity Level 1
Operating Temperature-Min -65 °C
Reverse Current-Max 0.1 µA
Reverse Test Voltage 9.1 V
Terminal Finish MATTE TIN OVER NICKEL

Compare BZV55C12 with alternatives

Compare BZT55C12L1G with alternatives