BZV55C15 vs BZV55C15 feature comparison

BZV55C15 Motorola Mobility LLC

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BZV55C15 Sangdest Microelectronics (Nanjing) Co Ltd

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Rohs Code No Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer MOTOROLA INC SANGDEST MICROELECTRONICS (NANJING) CO LTD
Part Package Code DO-34
Package Description O-LELF-N2 MELF-2
Pin Count 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 30 Ω
JESD-30 Code O-LELF-N2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 15 V 15 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 10% 6.12%
Working Test Current 5 mA 5 mA
Base Number Matches 5 8
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare BZV55C15 with alternatives

Compare BZV55C15 with alternatives